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TC3-3.5G

Part Number
TC3-3.5G
Manufacturer Chip Quik, Inc.
Other Part Numbers
315-TC3-3.5G-ND
315-TC3-3.5G
Description HEAT SINK THERMAL COMPOUND
Detailed Description Thermal Silicone Compound 3.5 gram Syringe
Manufacturer Standard Lead Time 4 weeks
Datasheet Datasheet

Product Attributes

Category
Manufacturer Chip Quik, Inc.
Series
CHIPQUIK®
Packaging
Bulk
Part Status Active
Color Gray
Size / Dimension 3.5 gram Syringe
Type Silicone Compound
Thermal Conductivity 8.50W/m-K
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start Date of Manufacture
Shelf Life 60 Months
Usable Temperature Range -40°F ~ 302°F (-40°C ~ 150°C)

Documents & Media

RESOURCE TYPE LINK
Datasheets TC3-3.5G
Featured Product TC3 Ultra Max™ Thermal Compound

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 3810.10.0000
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
RoHS Status ROHS3 Compliant

In Stock: 59

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