HDG200-DN-3 _ RF Transceiver ICs_RF and Wireless_SMCC_Chip _integrated circuit IC_connector_passive device

Part Number	HDG200-DN-3
Manufacturer	H&D Wireless
Other Part Numbers	HDG200-DN-3-ND -HDG200-DN-3
Description	IC RF TXRX+MCU WIFI 44TQFN
Detailed Description	IC RF TxRx + MCU WiFi 802.11b/g/n 2.4GHz 44-TQFN Exposed Pad Module
Manufacturer Standard Lead Time	14 weeks
Datasheet	Datasheet

Category		RF and Wireless RF Transceiver ICs
Manufacturer		H&D Wireless
Series
Packaging		Tray
Part Status		Active
Package / Case		44-TQFN Exposed Pad Module
Mounting Type		Surface Mount
Frequency		2.4GHz
Memory Size		1kB EEPROM, 160kB SRAM
Type		TxRx + MCU
Operating Temperature		-40°C ~ 85°C
Voltage - Supply		2.75V ~ 3.6V
Power - Output		17dBm
Protocol		802.11b/g/n
Current - Receiving		49mA
Data Rate (Max)		72.2Mbps
Current - Transmitting		197mA
Supplier Device Package		44-QFN SIP (8x8)
RF Family/Standard		WiFi
Serial Interfaces		SDIO, SPI
DigiKey Programmable		Not Verified

ATTRIBUTE		DESCRIPTION
ECCN		5A002A1
HTSUS		8542.39.0001
Moisture Sensitivity Level (MSL)		3 (168 Hours)
RoHS Status		ROHS3 Compliant

Can ship immediately.

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