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ASFC32G31T3-51BIN

ASFC32G31T3-51BIN

Part Number
ASFC32G31T3-51BIN
Manufacturer Alliance Memory, Inc.
Other Part Numbers
1450-ASFC32G31T3-51BIN-ND
1450-ASFC32G31T3-51BIN
Description 32G EMMC BGA 153 (-45-85C)
Detailed Description FLASH - NAND (TLC) Memory IC 256Gbit eMMC_5.1 200 MHz 153-FBGA (11.5x13)
Manufacturer Standard Lead Time 16 weeks
Datasheet Datasheet

Product Attributes

Category
Manufacturer Alliance Memory, Inc.
Series
Packaging
Tray
Part Status Active
Package / Case 153-TFBGA
Mounting Type Surface Mount
Memory Size 256Gbit
Memory Type Non-Volatile
Operating Temperature -40°C ~ 85°C (TA)
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NAND (TLC)
Clock Frequency 200 MHz
Memory Format FLASH
Supplier Device Package 153-FBGA (11.5x13)
Memory Interface eMMC_5.1
Memory Organization 32G x 8

Documents & Media

RESOURCE TYPE LINK
Datasheets ASFC32G31T3-51BIN

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN 3A991B1A
HTSUS 8542.32.0071
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
RoHS Status ROHS3 Compliant

In Stock: 120

Can ship immediately.
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